GYEON Q²M Compound + – Powerful cutting compound with high power and low secondary defects. Q²M Compound+ is a powerful cutting compound that provides improved scratch removal and high wear resistance with low dust and limited secondary defects. Although it leaves light holograms, these are easily removed with a single coat of Q²M Polish.

AVAILABLE VOLUME: 120 ML / 1000 ML Q²M Compoud+ is different from any other cutting polishing paste. Due to its water base, both speed and temperature must be reduced to achieve the best results. Work in small sections, moving the machine slowly over the surface.

TIP: The Q²M Compound+ has its highest cutting performance during the first period of the work cycle. Each attempt should not last longer than 45 seconds.

CONSUMPTION: 15-40 ML/PANEL CUTTING: ★★★★★★ FINISHING: ★★★★ Q²M Compound+ provides increased cutting power without the usual cost of large defects. The formula is water-based and contains high-quality Japanese abrasives, which allows for quick and easy removal of severe defects. The lack of silicone or fillers makes the coating preparation and polish removal procedure much faster and easier.